الفهرس الالي لمكتبة كلية العلوم و علوم التكنولوجيا
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Computational intelligence in image processing / Amitava Chatterjee
Titre : Computational intelligence in image processing Type de document : texte imprimé Auteurs : Amitava Chatterjee, Auteur ; Amitava Chatterjee Editeur : LONDON:SPRINGER Année de publication : 2012 Importance : xii, 301 pages Format : 24*17 cm ISBN/ISSN/EAN : 978-3-642-30620-4 Note générale : ASIN : B0B54QSL6Q
Éditeur : World Scientific Publishing Company (30 mai 2022)
Langue : Anglais
Taille du fichier : 29065 KB
Synthèse vocale : Activée
Lecteur d’écran : Pris en charge
Confort de lecture : ActivéLangues : Français (fre) Mots-clés : Computational intelligence in image processing image preprocessing algorithms image compression algorithms image analysis algorithms Index. décimale : 621.3 Résumé : Computational intelligence based techniques have firmly established themselves as viable, alternate, mathematical tools for more than a decade. They have been extensively employed in many systems and application domains, among these signal processing, automatic control, industrial and consumer electronics, robotics, finance, manufacturing systems, electric power systems, and power electronics. Image processing is also an extremely potent area which has attracted the attention of many researchers who are interested in the development of new computational intelligence-based techniques and their suitable applications, in both research problems and in real-world problems.
Part I of the book discusses several image preprocessing algorithms; Part II broadly covers image compression algorithms; Part III demonstrates how computational intelligence-based techniques can be effectively utilized for image analysis purposes; and Part IV shows how pattern recognition, classification and clustering-based techniques can be developed for the purpose of image inferencing. The book offers a unified view of the modern computational intelligence techniques required to solve real-world problems and it is suitable as a reference for engineers, researchers and graduate students.Computational intelligence in image processing [texte imprimé] / Amitava Chatterjee, Auteur ; Amitava Chatterjee . - [S.l.] : LONDON:SPRINGER, 2012 . - xii, 301 pages ; 24*17 cm.
ISBN : 978-3-642-30620-4
ASIN : B0B54QSL6Q
Éditeur : World Scientific Publishing Company (30 mai 2022)
Langue : Anglais
Taille du fichier : 29065 KB
Synthèse vocale : Activée
Lecteur d’écran : Pris en charge
Confort de lecture : Activé
Langues : Français (fre)
Mots-clés : Computational intelligence in image processing image preprocessing algorithms image compression algorithms image analysis algorithms Index. décimale : 621.3 Résumé : Computational intelligence based techniques have firmly established themselves as viable, alternate, mathematical tools for more than a decade. They have been extensively employed in many systems and application domains, among these signal processing, automatic control, industrial and consumer electronics, robotics, finance, manufacturing systems, electric power systems, and power electronics. Image processing is also an extremely potent area which has attracted the attention of many researchers who are interested in the development of new computational intelligence-based techniques and their suitable applications, in both research problems and in real-world problems.
Part I of the book discusses several image preprocessing algorithms; Part II broadly covers image compression algorithms; Part III demonstrates how computational intelligence-based techniques can be effectively utilized for image analysis purposes; and Part IV shows how pattern recognition, classification and clustering-based techniques can be developed for the purpose of image inferencing. The book offers a unified view of the modern computational intelligence techniques required to solve real-world problems and it is suitable as a reference for engineers, researchers and graduate students.Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité ST1163 621.3/59.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt Designing TSVs for 3D Integrated Circuits / Nauman Khan
Titre : Designing TSVs for 3D Integrated Circuits Type de document : texte imprimé Auteurs : Nauman Khan ; Soha Hassoun Editeur : LONDON:SPRINGER Année de publication : 2013 Importance : 76 pages Présentation : illustrations (some color) Format : 24*17 cm ISBN/ISSN/EAN : 978-1-4614-5507-3 Langues : Français (fre) Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisDesigning TSVs for 3D Integrated Circuits [texte imprimé] / Nauman Khan ; Soha Hassoun . - [S.l.] : LONDON:SPRINGER, 2013 . - 76 pages : illustrations (some color) ; 24*17 cm.
ISBN : 978-1-4614-5507-3
Langues : Français (fre)
Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisRéservation
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Exemplaires (2)
Code-barres Cote Support Localisation Section Disponibilité ST7017 621.38/269.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt ST7018 621.38/269.2 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Disponible Electrical engineering and intelligent systems / Sio-Iong Ao ; Len Gelman
Titre : Electrical engineering and intelligent systems Type de document : texte imprimé Auteurs : Sio-Iong Ao ; Len Gelman ; World Congress on Engineering Editeur : LONDON:SPRINGER Année de publication : 2012 Importance : xv, 417 pages Présentation : illustrations Format : 25 *18cm ISBN/ISSN/EAN : 978-1-4614-2316-4 Note générale : "A large international conference in electrical engineering and intelligent systems was held in London, UK, 6-8 July, 2011, under the World Congress on Engineering (WCE 2011)."--Preface. Langues : Français (fre) Mots-clés : Electrical engineering and intelligent systems partial exploration reconfigurable preexecution in data duality in complex learning of type-A closed loup bid adjustment reasonin on OWL2-WI-FI-effects of leaked impact of radio frequency identification Index. décimale : 621.3 Résumé : The revised and extended papers collected in this volume represent the cutting-edge of research at the nexus of electrical engineering and intelligent systems. They were selected from well over 1000 papers submitted to the high-profile international World Congress on Engineering held in London in July 2011. The chapters cover material across the full spectrum of work in the field, including computational intelligence, control engineering, network management, and wireless networks. Readers will also find substantive papers on signal processing, Internet computing, high performance computing, and industrial applications.
The Electrical Engineering and Intelligent Systems conference, as part of the 2011 World Congress on Engineering was organized under the auspices of the non-profit International Association of Engineers (IAENG). With more than 30 nations represented on the conference committees alone, the Congress features the best and brightest scientific minds from a multitude of disciplines related to engineering. These peer-reviewed papers demonstrate the huge strides currently being taken in this rapidly developing field and reflect the excitement of those at the frontiers of this research.Electrical engineering and intelligent systems [texte imprimé] / Sio-Iong Ao ; Len Gelman ; World Congress on Engineering . - [S.l.] : LONDON:SPRINGER, 2012 . - xv, 417 pages : illustrations ; 25 *18cm.
ISBN : 978-1-4614-2316-4
"A large international conference in electrical engineering and intelligent systems was held in London, UK, 6-8 July, 2011, under the World Congress on Engineering (WCE 2011)."--Preface.
Langues : Français (fre)
Mots-clés : Electrical engineering and intelligent systems partial exploration reconfigurable preexecution in data duality in complex learning of type-A closed loup bid adjustment reasonin on OWL2-WI-FI-effects of leaked impact of radio frequency identification Index. décimale : 621.3 Résumé : The revised and extended papers collected in this volume represent the cutting-edge of research at the nexus of electrical engineering and intelligent systems. They were selected from well over 1000 papers submitted to the high-profile international World Congress on Engineering held in London in July 2011. The chapters cover material across the full spectrum of work in the field, including computational intelligence, control engineering, network management, and wireless networks. Readers will also find substantive papers on signal processing, Internet computing, high performance computing, and industrial applications.
The Electrical Engineering and Intelligent Systems conference, as part of the 2011 World Congress on Engineering was organized under the auspices of the non-profit International Association of Engineers (IAENG). With more than 30 nations represented on the conference committees alone, the Congress features the best and brightest scientific minds from a multitude of disciplines related to engineering. These peer-reviewed papers demonstrate the huge strides currently being taken in this rapidly developing field and reflect the excitement of those at the frontiers of this research.Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité ST1164 621.3/64.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt grid integration and dynamic impact of wind energy / vittal vijay
Titre : grid integration and dynamic impact of wind energy : power electronics and power systems Type de document : texte imprimé Auteurs : vittal vijay, Auteur ; RAJA,AYYANAR, Auteur Editeur : LONDON:SPRINGER Année de publication : 2013 Importance : 148p Format : 24*17cm ISBN/ISSN/EAN : 978-1-4419-9322-9 Note générale : Series: Power Electronics and Power Systems (Book 1)
Hardcover: 150 pages
Publisher: Springer; 2012 edition (July 21, 2012)
Language: English
ISBN-10: 1441993223
ISBN-13: 978-1441993229Langues : Français (fre) Mots-clés : grid integration and dynamic impact of wind energy power electronics and power systems electronic concepts wind energy generators performance Index. décimale : 621.04 Energie Renouvelable Résumé : Grid Integration and Dynamic Impact of Wind Energy details the integration of wind energy resources to the electric grid worldwide. Authors Vijay Vittal and Raja Ayyanar include detailed coverage of the power converters and control used in interfacing electric machines and power converters used in wind generators, and extensive descriptions of power systems operation and control to accommodate large penetration of wind resources.
Key concepts will be illustrated through extensive power electronics and power systems simulations using software like MATLAB, Simulink and PLECS. The book addresses real world problems and solutions in the area of grid integration of wind resources, and will be a valuable resource for engineers and researchers working in renewable energy and power.grid integration and dynamic impact of wind energy : power electronics and power systems [texte imprimé] / vittal vijay, Auteur ; RAJA,AYYANAR, Auteur . - [S.l.] : LONDON:SPRINGER, 2013 . - 148p ; 24*17cm.
ISBN : 978-1-4419-9322-9
Series: Power Electronics and Power Systems (Book 1)
Hardcover: 150 pages
Publisher: Springer; 2012 edition (July 21, 2012)
Language: English
ISBN-10: 1441993223
ISBN-13: 978-1441993229
Langues : Français (fre)
Mots-clés : grid integration and dynamic impact of wind energy power electronics and power systems electronic concepts wind energy generators performance Index. décimale : 621.04 Energie Renouvelable Résumé : Grid Integration and Dynamic Impact of Wind Energy details the integration of wind energy resources to the electric grid worldwide. Authors Vijay Vittal and Raja Ayyanar include detailed coverage of the power converters and control used in interfacing electric machines and power converters used in wind generators, and extensive descriptions of power systems operation and control to accommodate large penetration of wind resources.
Key concepts will be illustrated through extensive power electronics and power systems simulations using software like MATLAB, Simulink and PLECS. The book addresses real world problems and solutions in the area of grid integration of wind resources, and will be a valuable resource for engineers and researchers working in renewable energy and power.Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité ST2146 621.04/66.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt