الفهرس الالي لمكتبة كلية العلوم و علوم التكنولوجيا
Résultat de la recherche
1 résultat(s) recherche sur le mot-clé 'square or cylindrical tsv'
Affiner la recherche Générer le flux rss de la recherche
Partager le résultat de cette recherche Interroger des sources externes
Designing TSVs for 3D Integrated Circuits / Nauman Khan
Titre : Designing TSVs for 3D Integrated Circuits Type de document : texte imprimé Auteurs : Nauman Khan ; Soha Hassoun Editeur : LONDON:SPRINGER Année de publication : 2013 Importance : 76 pages Présentation : illustrations (some color) Format : 24*17 cm ISBN/ISSN/EAN : 978-1-4614-5507-3 Langues : Français (fre) Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisDesigning TSVs for 3D Integrated Circuits [texte imprimé] / Nauman Khan ; Soha Hassoun . - [S.l.] : LONDON:SPRINGER, 2013 . - 76 pages : illustrations (some color) ; 24*17 cm.
ISBN : 978-1-4614-5507-3
Langues : Français (fre)
Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisRéservation
Réserver ce document
Exemplaires (2)
Code-barres Cote Support Localisation Section Disponibilité ST7017 621.38/269.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt ST7018 621.38/269.2 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Disponible