الفهرس الالي لمكتبة كلية العلوم و علوم التكنولوجيا
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Designing TSVs for 3D Integrated Circuits / Nauman Khan
Titre : Designing TSVs for 3D Integrated Circuits Type de document : texte imprimé Auteurs : Nauman Khan ; Soha Hassoun Editeur : LONDON:SPRINGER Année de publication : 2013 Importance : 76 pages Présentation : illustrations (some color) Format : 24*17 cm ISBN/ISSN/EAN : 978-1-4614-5507-3 Langues : Français (fre) Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisDesigning TSVs for 3D Integrated Circuits [texte imprimé] / Nauman Khan ; Soha Hassoun . - [S.l.] : LONDON:SPRINGER, 2013 . - 76 pages : illustrations (some color) ; 24*17 cm.
ISBN : 978-1-4614-5507-3
Langues : Français (fre)
Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisRéservation
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Code-barres Cote Support Localisation Section Disponibilité ST7017 621.38/269.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt ST7018 621.38/269.2 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Disponible Nanotechnology
Titre : Nanotechnology : global strategies, industry trends and applications Type de document : texte imprimé Auteurs : Jurgen Schulte, Editeur scientifique Editeur : Chichester : J. Wiley & sons Année de publication : cop. 2005 Importance : 1 vol. (XII-182 p.) Présentation : ill. Format : 24 cm ISBN/ISSN/EAN : 0-470-85400-6 Note générale : Éditeur : Wiley–Blackwell (11 mars 2005)
Langue : Anglais
Relié : 194 pages
ISBN-10 : 0470854006
ISBN-13 : 978-0470854006
Poids de l'article : 420 g
Dimensions : 15.62 x 1.65 x 23.37 cm
Langues : Anglais (eng) Mots-clés : Nanotechnology carbon nanotubes venture capital frontiers of nanotechnology polymeric nanofibres Index. décimale : 620 Résumé : " a valuable reference." ( IEEE Circuits & Devices Magazine, September/October 2006)
Quatrième de couverture
The rapid growth of miniaturisation to meet the demand forincreasingly smart devices is driving global investment in a widerange of industries such as IT, electronics, energy, biotechnologyand materials science.
Nanotechnology: Global Strategies, Industry Trends andApplications, written by experts from Asia, Europe and the USA,gives a comprehensive and important global perspective onnanotechnology.
The book is divided into 3 parts:
National Nanotechnology Initiatives in Asia, Europe and theUSAexplores the current status of nanotechnology in China,Korea, Europe and the USA.
Investing in Nanotechnology provides practicalinformation about the opportunities and risks involved innanotechnology and predictions for future growth.
Frontiers of Nanotechnology discusses futureapplications of the technology and the real–world issuessurrounding these.
Outlining developing trends, emerging opportunities, associatedrisks and future applications, this book is essential reading forprofessionals, prospective investors and policy makers who need anaccessible introduction to the topic.
Biographie de l'auteur
Jurgen Schulte is the editor of Nanotechnology: Global Strategies, Industry Trends and Applications, published by Wiley.Note de contenu : index
Notes bibliogr.Nanotechnology : global strategies, industry trends and applications [texte imprimé] / Jurgen Schulte, Editeur scientifique . - Chichester : J. Wiley & sons, cop. 2005 . - 1 vol. (XII-182 p.) : ill. ; 24 cm.
ISBN : 0-470-85400-6
Éditeur : Wiley–Blackwell (11 mars 2005)
Langue : Anglais
Relié : 194 pages
ISBN-10 : 0470854006
ISBN-13 : 978-0470854006
Poids de l'article : 420 g
Dimensions : 15.62 x 1.65 x 23.37 cm
Langues : Anglais (eng)
Mots-clés : Nanotechnology carbon nanotubes venture capital frontiers of nanotechnology polymeric nanofibres Index. décimale : 620 Résumé : " a valuable reference." ( IEEE Circuits & Devices Magazine, September/October 2006)
Quatrième de couverture
The rapid growth of miniaturisation to meet the demand forincreasingly smart devices is driving global investment in a widerange of industries such as IT, electronics, energy, biotechnologyand materials science.
Nanotechnology: Global Strategies, Industry Trends andApplications, written by experts from Asia, Europe and the USA,gives a comprehensive and important global perspective onnanotechnology.
The book is divided into 3 parts:
National Nanotechnology Initiatives in Asia, Europe and theUSAexplores the current status of nanotechnology in China,Korea, Europe and the USA.
Investing in Nanotechnology provides practicalinformation about the opportunities and risks involved innanotechnology and predictions for future growth.
Frontiers of Nanotechnology discusses futureapplications of the technology and the real–world issuessurrounding these.
Outlining developing trends, emerging opportunities, associatedrisks and future applications, this book is essential reading forprofessionals, prospective investors and policy makers who need anaccessible introduction to the topic.
Biographie de l'auteur
Jurgen Schulte is the editor of Nanotechnology: Global Strategies, Industry Trends and Applications, published by Wiley.Note de contenu : index
Notes bibliogr.Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité ST11929 620/219.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt