الفهرس الالي لمكتبة كلية العلوم و علوم التكنولوجيا
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Designing TSVs for 3D Integrated Circuits / Nauman Khan
Titre : Designing TSVs for 3D Integrated Circuits Type de document : texte imprimé Auteurs : Nauman Khan ; Soha Hassoun Editeur : LONDON:SPRINGER Année de publication : 2013 Importance : 76 pages Présentation : illustrations (some color) Format : 24*17 cm ISBN/ISSN/EAN : 978-1-4614-5507-3 Langues : Français (fre) Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisDesigning TSVs for 3D Integrated Circuits [texte imprimé] / Nauman Khan ; Soha Hassoun . - [S.l.] : LONDON:SPRINGER, 2013 . - 76 pages : illustrations (some color) ; 24*17 cm.
ISBN : 978-1-4614-5507-3
Langues : Français (fre)
Mots-clés : Designing TSVs for 3D Integrated Circuits square or cylindrical tsv annular tapered coaxial poweroptimal carbon nanotubes Index. décimale : 621.38 Résumé : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper Note de contenu : Poids de l'article : 1.64 kg
Broché : 76 pages
ISBN-10 : 1461455073
ISBN-13 : 978-1461455073
Dimensions : 15.49 x 0.53 x 23.5 cm
Éditeur : Springer-Verlag New York Inc. (23 septembre 2012)
Langue : : AnglaisRéservation
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Code-barres Cote Support Localisation Section Disponibilité ST7017 621.38/269.1 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Exclu du prêt ST7018 621.38/269.2 Ouvrage Faculté des Sciences et de la Technologie 600 - Technologie (Sciences appliquées) Disponible